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Added additional register banks to report output for Winbond chips.

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This commit is contained in:
Michael Möller
2010-02-19 14:08:56 +00:00
parent bac676e771
commit a60755377f
2 changed files with 3 additions and 3 deletions
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2
Hardware/LPC/W836XX.cs
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@@ -219,7 +219,7 @@ namespace OpenHardwareMonitor.Hardware.LPC {
} }
r.AppendLine(); r.AppendLine();
} }
for (int k = 1; k <= 5; k++) { for (int k = 1; k <= 15; k++) {
r.AppendLine("Bank " + k); r.AppendLine("Bank " + k);
for (int i = 0x5; i < 0x6; i++) { for (int i = 0x5; i < 0x6; i++) {
r.Append(" "); r.Append((i << 4).ToString("X2")); r.Append(" "); r.Append(" "); r.Append((i << 4).ToString("X2")); r.Append(" ");

4
Properties/AssemblyInfo.cs
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@@ -69,5 +69,5 @@ using System.Runtime.InteropServices;
// You can specify all the values or you can default the Build and Revision Numbers // You can specify all the values or you can default the Build and Revision Numbers
// by using the '*' as shown below: // by using the '*' as shown below:
// [assembly: AssemblyVersion("1.0.*")] // [assembly: AssemblyVersion("1.0.*")]
[assembly: AssemblyVersion("0.1.21.3")] [assembly: AssemblyVersion("0.1.21.4")]
[assembly: AssemblyFileVersion("0.1.21.3")] [assembly: AssemblyFileVersion("0.1.21.4")]